China’s EUV Light-Source Claim Draws Scrutiny in Korea’s Chip Industry
A Chinese equipment maker says its domestically produced extreme-ultraviolet light-source prototype could enter mass production within three to five years, but Korean specialists say major technical barriers still separate the system from commercial chipmaking equipment.
A Chinese semiconductor-equipment company’s claim that it has developed a largely domestically produced extreme-ultraviolet light-source system is drawing close attention in South Korea, where the technology could eventually affect the competitive position of Samsung Electronics and SK hynix.
Shanghai-based Langdao Silex displayed a prototype at the China International Industry Fair on October 13. A representative at the exhibition said the system had a localization rate of 90 percent and that most key components had been developed in China. The company estimated that mass production could begin within three to five years.
The announcement is significant because EUV lithography is essential for manufacturing leading-edge semiconductors. Commercial EUV scanners are produced exclusively by Dutch equipment company ASML, while United States-led export controls have prevented their shipment to China. Chinese chipmakers have instead relied on older deep-ultraviolet tools and more complicated production methods while domestic suppliers try to close the equipment gap.
A successful Chinese alternative could alter competition in both foundry and memory chips, two markets in which Korean companies hold major positions. It could also weaken one of the principal technology constraints on China’s efforts to make advanced processors for artificial intelligence.
However, the prototype described in Shanghai is a light-source system rather than a complete commercial lithography scanner, and Korean specialists cited in the report expressed strong doubt that it could quickly be converted into equipment suitable for high-volume production.
The gap is visible in reported power levels. Langdao Silex lists a laser output of 1,000 watts and EUV output of about 15 watts for its system. Commercial lithography requires far more powerful and stable light generation, with current systems using laser power measured in tens of kilowatts and EUV source power above 600 watts.
Optics present another barrier. EUV light, with a wavelength of 13.5 nanometers, is absorbed by most materials and therefore requires exceptionally precise multilayer mirrors. Germany’s Zeiss is the sole supplier of the specialized optical systems used in ASML’s machines. Producing those mirrors requires stacking extremely thin silicon and molybdenum layers with extraordinary precision.
ASML Chief Executive Christophe Fouquet also dismissed expectations of a rapid breakthrough, saying China still faced a very long journey. Korean researchers likewise argued that decades of accumulated expertise in light sources, optics and system integration could not be reproduced in only a few years.
The prototype nevertheless shows that China is continuing to direct resources toward overcoming semiconductor export controls. For Korean chipmakers, the immediate competitive threat appears limited, but progress in China’s domestic equipment program remains a long-term strategic issue that could reshape investment, technology partnerships and market share.
